【摘要】 对可加工CeZrO2 /CePO4陶瓷材料的设计制备和性能进行了研究。结果表明 :在载荷作用下弱界面处易形成微裂纹 ,并发生裂纹联接 ,使材料在加工过程中以晶粒去除形式为主 ,实现了该材料的金属刀具加工 ,且加工损伤变小。弱界面处微裂纹的形成、偏转和桥联等形式 ,耗散了主裂纹扩展的能量 ,增加了材料的断裂功 ,可在一定程度上改善材料的强度等力学性能。随着CePO4加入量的增加 ,弱界面增多 ,CeZrO2 /CePO4陶瓷材料的可加工性变好但力学性能却变差。烧成温度等工艺因素对CeZrO2 /2 5 %CePO4(质量分数 )陶瓷的强度等力学性能影响较大 ,在 15 5 0℃下加热 2h ,颗粒尺寸与发生裂纹桥联等形式相适应 ,可充分发挥弱界面的作用更多还原

【Abstract】 The preparation of machinable CeZrO 2/CePO 4 ceramic material and its mechanical properties were investigated. The result indicates that micro-cracks are easily formed and the joining of cracks are taken place at the weak interface under pressures, which causes the grain elimination to be the main form in the process of machining. It makes possible that CeZrO 2/CePO 4 ceramic material can be machined with metallic cutter with a little machining damage. At the same time the mechanical properties of the material can be improved to some extend due to the dissipation of most energy of primary crack expanding and increase of the fracture work for material eventually by the formation, deflection and bridging of cracks at weak interface. With the increase of doping CePO 4 the numbers of weak interface are increased and the machinability of CeZrO 2/CePO 4 ceramic material meliorates while the mechanical properties deteriorates at the same time. Technological factors, such as sintering temperature, have much influence on the properties of CeZrO 2/CePO 4 ceramic. The functions of weak interface can be brought into full play by particle sizes together with the bridging of crack etc at the condition of 1 550 ℃ for 2 h.更多还原