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高导电耐磨铜基复合材料的研究

Copper Matrix Composites with High Conductivity and Wear Resistance

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【作者】 湛永钟张国定蔡宏伟

【Author】 ZHAN Yong-zhong~1, ZHANG Guo-ding~1, CAI Hong-wei~2(1. Shanghai Jiaotong University, Shanghai 200030, China; 2. Shanghai Research Institute of Materials, Shanghai 200437, China)

【机构】 上海交通大学金属基复合材料国家重点实验室上海材料研究所 上海200030上海200030上海200437

【摘要】 用冷压 烧结 热挤压工艺制备了SiCp/Cu复合材料,得到组织均匀、致密、导电导热的复合材料。干磨损试验结果表明,随着SiC含量的提高,复合材料具有更高的耐磨性;SiC颗粒增强物的加入减小了材料的粘着磨损,使复合材料在高载荷条件下具有更为优越的耐磨性。SiC体积分数不超过15%的铜基复合材料具有比铬锆铜合金更高的导电、导热性能和耐磨性。

【Abstract】 Copper matrix composites reinforced with SiC particles were fabricated by a powder metallurgy plus hot extrusion method. It was shown that the microstructure is uniform and compact, while the electrical and thermal conductivity is high for these composites. The addition of SiC particulate reinforcement decreases the adhesive extent between the matrix and the counterpart, thus improves the wear resistance of the composites, especially under high load level test condition. Copper matrix composites reinforced with SiC particles no more than 15vol.% exhibit better electrical conductivity, thermal conductivity and wear resistance than the Cu-Cr-Zr alloy.

【基金】 上海市重大科技攻关项目
  • 【文献出处】 机械工程材料 ,Materials For Mechanical Engineering , 编辑部邮箱 ,2003年11期
  • 【分类号】TB33
  • 【被引频次】53
  • 【下载频次】592
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