【摘要】 通过Sol-Gel方法和半导体工艺,制备出基于Ba_0.8Sr_0.2TiO₃（BST）薄膜的非致冷红外焦平面阵列（UFPA）探测单元。用ANSYS有限元分析软件,对探测单元进行了热分析。分析结果表明:微桥的大小可以极大的影响薄膜受到辐射后的温度以及薄膜温度的均匀性。对微桥和硅衬底上的BST薄膜进行了结构和性能上的对比。发现微桥上面的BST薄膜其介电常数有所下降,漏电流增加。而且为了得到致密无裂纹的BST薄膜,必须减少它的厚度。对所制备的UFPA探测单元进行了红外测试,得到1.6mV左右的信号输出,可以满足下一步信号处理的需要。更多还原

【Abstract】 UFPA detector pixel based on BST thin films was prepared by Sol-Gel method and semi- conductor process. Thermal analysis was conducted using ANSYS5.7 software. The result shows that the presence of microbridge can improve the responsivity upon thermal radiation. The changes on structure and dielectric properties are compared for BST thin films with and without microbridge res- pectively. The dielectric constant decreases and the leakage current increases with the presence of microbridge. And the thinner thickness is needed for crack free BST thin films. The final electrical output of 1.6mV is obtained, which can provide appropriate signal for later process.更多还原