【摘要】 在电子电路表面组装(SMT)工艺中,再流焊过程工艺参数设定被认为是影响焊接质量和产品可靠性的主要因素。结合实际的再流焊工艺,提出了一种简化的再流焊工艺建摸方法,建立了再流焊工艺仿真模型并对模型建立了求解器,利用求解器对红外对流再流焊过程中PCB组件温度曲线进行了仿真预测。仿真结果对于再流焊工艺参数设置以及提高焊接质量具有较大的实际应用价值。更多还原

【Abstract】 Setting the parameters of the reflow oven is considered one of the main reasons for manufacturing defects and reliability in the process of SMT. According to the factual reflow soldering processes,this paper describes less simplified simulated models both of the product and process and designs a solver for the models,applying these representations to predict the temperature profile of PCB assemblies in the infrared and convection reflow soldering process.The simulated results are benefit to enhance the products’ quality.更多还原