【摘要】 综述了近年来国内外在含氟聚酰亚胺 (PI)研究及应用领域中的最新进展情况。主要从现代微电子工业对相关材料的性能要求、标准型聚酰亚胺材料所面临的挑战以及新型含氟聚酰亚胺在微电子工业中的应用等几个方面进行了详细的综述。重点阐述了中国科学院化学研究所 30 5组近几年在这方面的研究进展情况。并指出为了推动我国微电子工业的发展 ,研制开发低成本、高技术含量的含氟聚酰亚胺材料具有十分重要的现实意义。更多还原

【Abstract】 In the article,the latest research and application development of fluorinated polyimides have been summarized.Fluorinated polyimides have been widely used in many high technical fields for the excellent thermal properties,electrical properties and mechanical properties.In recent years,with the development of microelectronics industry,fluorinated polyimides are gaining increasing attention in passivation and packaging applications.The applications of fluorinated polyimides in electro\|optic ansd liquid crystal display (LCD) and low dielectric constant materials fields,especially the corresponding works of institute of chemistry were discussed in detail.In order to meet the stringent needs of microelectronics industry on materials,the functional fluorinated polyimides must be researched and developed.更多还原