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氧化铝陶瓷基板过孔的新型激光打孔工艺
New Laser Drilling Technique for Making Via Holes on Alumina Substrates
【摘要】 陶瓷基板激光打孔一固有缺点即孔周围会形成大量不规则堆溅物。提出一种直接在凝胶注模成型陶瓷素坯上激光打孔的新工艺。Nd:YAG激光在氧化铝上打孔的研究表明,该方法能大大减少堆溅物的形成,从而得到分布致密、形状规则的微孔。
【Abstract】 Undesired spatters are often caused by laser-drilling process. A new gelcast green body laser-drilling technique is presented. With the technology, spatters are minimized and the holes on alumina boards drilled by Nd:YAG laser are irregular and fine.
- 【文献出处】 电子元件与材料 ,Electronic Components $ Materials , 编辑部邮箱 ,2003年03期
- 【分类号】TN249
- 【被引频次】9
- 【下载频次】550