【摘要】 介绍了选择性化学镀镍、浸金工艺的原理、流程和操作参数。该技术用于印刷线路板表面精饰,镀层平整、电阻小、锡焊性好、耐磨性强。更多还原

【Abstract】 Mechanism, procedures and operation parameters of selective electroless nickel plating and gold immersion (SENi/IG) were introduced. SENi/IG technology was applied for PCB surface finishing. The deposit has good solderability, wear resistance, leveling appearance and small electric resistance.更多还原