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低氰脉冲光亮镀金工艺研究
Study of low cyanide bright gold plating process with pulse current
【摘要】 开发出一种低氰脉冲光亮镀金工艺。研究了工艺条件对其镀层性能的影响。本工艺具有施镀电流密度范围宽、镀液稳定可靠以及镀层性能优越等特点。
【Abstract】 A lowcyanide bright gold plating process with pulse current was developed. Effects of process conditions on properties of deposit were studied.The process has features of wide range of current density, stable solution and good deposit properties.
- 【文献出处】 电镀与涂饰 ,Electroplating & Finishing , 编辑部邮箱 ,2003年03期
- 【分类号】TQ153.18
- 【被引频次】8
- 【下载频次】165