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纳米多孔二氧化硅薄膜的制备及性能

Fabrication and characterization of nanoporous silica film

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【作者】 殷明志姚熹吴小清

【Author】 YIN Mingzhi YAO Xi WU Xiaoqing(Electronic Materials Research Laboratory, Xi’an Jiaotong University 710049 China) To whom correspondence should be addressed, Tel:(029)2668679

【机构】 西安交通大学电子材料及器件研究所西安交通大学西安交通大学 西安市 710049

【摘要】 以N(C8H15)4+OH-为催化剂,用正硅酸乙脂(TEOS)溶胶-凝胶工艺制备出纳米多孔二氧化硅薄膜。体系的H2O/TEOS>25,强碱催化使二氧化硅的溶解度增大并使二氧化硅胶粒带负电荷,抑制了二氧化硅的聚合。丙三醇与TEOS的水解中间体Si(OC2H54-x(OH)x及二氧化硅胶粒SixOy(OH)z+n表面Si-OH形成氢键,抑制了二氧化硅的聚沉。聚乙烯醇(PVA)使粒状二氧化硅溶胶具有网状结构,易于成膜。薄膜由致密结构转化为均匀纳米多孔结构是构成薄膜的二氧化硅胶粒在热处理时聚集和塑性形变的结果。多孔二氧化硅薄膜的折射率为1.27~1.42,介电常数为1.578~2.016,热导率为0.2W/(m·K)。

【Abstract】 Crack-free homogeneous nanoporous silica films were prepared with colloidal silica sol derived by sol-gel process of tetraethylorthosilicate (TEOS) catalyzed with R4N+OH-. The solution with ratio of H2O/TEOS>25, R4N+ and glycerol were combined with the intermediate Si(OR)4-x;(OH)x and SixOy(OH)z+nr avoiding aggregation of the nanosilica particles, presence of the poly(vinyl alcohol) (PVA) made colloidal silica sol a polymeric structure (filming easily). The silica films have heterostructure, which can avoid crack of the nanoporous silica films during being annealed. The homogeneous nanoporous silica films can develop due to accumulated structure of silica particle within films during annealing. The pore sizes distribute between 100-200 nm after annealed at 850 ℃ for 30 min. The refractive indexes were 1.27-1.42, the dielectric constant was 1.4-2, the thermal conductivity was 0.2 W/m.K.

【基金】 国家重点发展规划(973)资助项目 No.2002CB613305
  • 【文献出处】 材料研究学报 ,Chinese Journal of Materials Research , 编辑部邮箱 ,2003年02期
  • 【分类号】TB43
  • 【被引频次】33
  • 【下载频次】1838
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