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复合化学镀Ni-Cu-P/PTFE工艺的研究

Electroless Ni-Cu-P/PTFE Composite Plating Technology

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【作者】 杜克勤寇瑾高玉洲

【Author】 DU Keqin1, KOU Jin2, GAO Yuzhou3(1. Department of Environmental Science and Engineering, Dalian Railway University, Dalian 116028; 2. Liaoning Police Academy, Dalian 116033; 3. Institute of Materials & Technology, Dalian Maritime University, Dalian 116026, China)

【机构】 大连铁道学院环境科学与工程系辽宁警官高等专科学校大连海事大学材料及工艺研究所 辽宁大连116028辽宁大连116033辽宁大连116026

【摘要】 研究了PTFE悬浮量、表面活性剂复配量对复合化学镀膜的镀速、结构、成分、耐腐蚀性及耐磨性的影响,结果表明,PTFE悬浮量和表面活性剂复配量的提高,镀膜的镀速、铜的百分含量和摩擦系数均有大幅度的下降,腐蚀速度略有降低,镀膜的相结构没有大的变化,试验表明,Ni Cu P/PTFE复合化学镀膜具有优良的自润滑性能。

【Abstract】 The effects of PTFE dispersed concentration and surfactant on the growth velocity, structure, composite, corrosion and wear resistance of composite electroless plating were studied. The results showed that when the concentration of dispersed PTFE and surfactant increased, the growth velocity, copper content and friction coefficient of NiCuP/PTFE composite plating decreased tremendously, whereas its corrosion rate decreased slightly by and large and phase structure of plating was with little change. Experiments proved that the NiCuP/PTFE composite plating had excellent selflubricating property.

  • 【文献出处】 材料保护 ,Materials Protection , 编辑部邮箱 ,2003年11期
  • 【分类号】TQ153.3
  • 【被引频次】4
  • 【下载频次】203
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