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复合化学镀Ni-Cu-P/PTFE工艺的研究
Electroless Ni-Cu-P/PTFE Composite Plating Technology
【摘要】 研究了PTFE悬浮量、表面活性剂复配量对复合化学镀膜的镀速、结构、成分、耐腐蚀性及耐磨性的影响,结果表明,PTFE悬浮量和表面活性剂复配量的提高,镀膜的镀速、铜的百分含量和摩擦系数均有大幅度的下降,腐蚀速度略有降低,镀膜的相结构没有大的变化,试验表明,Ni Cu P/PTFE复合化学镀膜具有优良的自润滑性能。
【Abstract】 The effects of PTFE dispersed concentration and surfactant on the growth velocity, structure, composite, corrosion and wear resistance of composite electroless plating were studied. The results showed that when the concentration of dispersed PTFE and surfactant increased, the growth velocity, copper content and friction coefficient of NiCuP/PTFE composite plating decreased tremendously, whereas its corrosion rate decreased slightly by and large and phase structure of plating was with little change. Experiments proved that the NiCuP/PTFE composite plating had excellent selflubricating property.
【Key words】 electroless Ni-Cu-P/PTFE plating; content of surfactant; self-lubricating property;
- 【文献出处】 材料保护 ,Materials Protection , 编辑部邮箱 ,2003年11期
- 【分类号】TQ153.3
- 【被引频次】4
- 【下载频次】203