【摘要】 从原有的化学镀锡的工业配方出发,对其用量进行改良,特别是镀液的pH值调试,配体的使用和还原剂的用量,在硅片上沉积出一层光亮而且致密的铜薄膜。结果表明,在二甲基亚砜中硅铜基体上的电沉积铋薄膜均匀、致密、粘附力强,XRD测试表明铋以晶体析出。更多还原

【Abstract】 First industrial formula of electroless copper plating was improved to obtain a bright and compact copper film on the silicon slice, especially for the pH value, complexing agent and reductant. Later bismuth film was elec-trodeposited on the silicon/copper substrate in a non-aqueous solution. Results showed that the bismuth film was uni-form and compact and good adhesion to matrix, and the bismuth was granule form.更多还原