【摘要】 采用体硅微机械加工技术制作田字形结构的高量程微加速度计芯片。为了研究芯片的抗过载能力 ,使用Hopkinson杆对其施加冲击载荷 ,以一维应力波理论估计芯片受到的加速度。结果显示 ,芯片破坏的临界载荷为 2 0 0kgn。裂纹和断裂主要发生在十字架中心、边框的 4个角以及十字梁和边框的连接部位。更多还原

【Abstract】 Cross-shaped, high-g microaccelerometer chips have been developed using silicon micromachining techniques. In order to determine the Shock-resistibility of the chip, tests were performed using Hopkinson bar. The acceleration was estimated according to the theory of one-dimensional stress wave. The results show that the critical load resulting in chip failure is about 200,000 g n.Cracks concentrate on the center of cross, corners of frame and juncture between cross and frame.更多还原