【摘要】 介绍了最新优化设计的双 E型加速度传感器硅芯片结构和工艺的实现。通过控制不同敏感硅芯片弹性膜的厚度 ,即可制得不同量程的双 E型敏感硅芯片和加速度传感器。更多还原

【Abstract】 The new silicon chip of dual-E detailed introduction of the structure and the realization of the technology is reported. Producing the chip and the sensitive element of different scales by controlling the thickness of different sensitive films.更多还原