【摘要】 用循环Ar+轰击 磁控溅射离子镀(MSIP)和化学镀分别在U表面上沉积Cu、Ni P/Cu,并采用俄歇电子能谱仪(SAM)、扫描透射电镜(STEM)、电化学实验,研究了其表面、剖面形貌和耐蚀性能,以及U基和镀层界面。结果表明:U上循环Ar+轰击 磁控溅射离子镀Cu结晶细密,界面存在较宽的原子共混区,U表面先溅射沉积Cu镀层,再化学镀非晶态Ni P镀层,能够有效地改善镀层的结合强度。更多还原

【Abstract】 Cu?Ni-P/Cu coatings on U substrates are prepared by repeated Ar+ bombardment-magnetron sputtering ion plated (MSIP) and electroless plating. The surface morphology, cross-section morphology, composition distribution of interfaces between the coatings and substrates, and corrosion resistance have been investigated by Auger electron spectroscopy (AES), scanning transmission electron microscopy(STEM), and electrochemical test respectively. The results show that the surface morphology of Cu coating is made up of dense fine grains. The more wide co-existence interface of Cu coatings and U substrates are obtained by repeated Ar+ bombardment-magnetron sputter ion plated. The adhesive strength of coatings can be improved greatly by the sputtering deposition of Cu followed by plating the amorphous Ni-P coatings.更多还原