【摘要】 主要介绍了一种Cu的CELT加工的化学刻蚀体系和捕捉体系 ,并通过控制刻蚀时间、刻蚀电流、刻蚀剂浓度、捕捉剂浓度等实验参数和优化电化学模板的制作工艺 ,以规整的齿状结构为模板 ,在Cu的表面实现了三维微结构的复制加工 ,得到了与齿状结构模板互补的三维微结构 ,用SEM和AFM对实验结果进行了表征 ,表征结果证明约束刻蚀剂层技术在金属三维加工方面的可行性和潜在优势。金属Cu由于具有优良的导热导电性能以及很好的延展性 ,在微系统 (也称微机电系统 )中应用广泛 ,因此对Cu的刻蚀加工对微系统技术的发展具有重要的意义。约束刻蚀剂层技术 (ConfinedEtch antLayerTechnique简称CELT)作为一种新型的微加工技术[1] ,能够加工复制出复杂三维结构 ,到目前为止 ,该技术已成功应用于Si、GaAs等材料微结构的复制加工[2 ,3] 。更多还原

【Abstract】 As a novel microfabrication technique, CELT (Confined Etchant Layer Technique) has a great significance for the development of micro electro mechanical system (MEMS) because of its capability of replicating three dimensional complex structures. Previously, CELT has been successfully applied on semiconductor materials such as Si, GaAs. Recently the micromaching of Cu with three dimensional (3D) gear like molds was performed by CELT regarding its good heat and electricity conductivity and wide application in MEMS. An effective chemical etching and scavenging system for Cu micromachining has been found. By optimizing the experimental parameters, such as etching time, etching current density, concentration of etchant or scavenger, we obtained the etched pattern which is approximately negative copy of the gear like mold. The results were analyzed with SEM and AFM, which proves that CELT is a promising technique forthe 3D fabrication on metals.更多还原