【摘要】 设计了一种Au Si键合强度检测结构。通过对一组不同尺寸压臂式测试结构的检测 ,可以由结构尺寸半定量地折算出键合面的键合强度 ;采用同一结构尺寸 ,可以比较不同条件下键合强度的相对大小 ;此结构还可用于其它类型键合强度的比较和测试。通过压臂法检测了Au Si键合强度 ,其数值高于硅片基体本身的强度更多还原

【Abstract】 A test structure of Au Si bonding intensity has been designed. When the bonding interface is cracked, the values of l and a will be measured by microscope. The bonding intensity can be calculated by the values of l, a, and P. Two different bonding intensities can be compared with the same size of the structure. The structure may be used for measuring and comparing the similar kinds of bonding intensities. The Au Si bonding intensity is gotten by a series of press arm style experiments of the structure. This value is bigger than the intensity of the Si substrate.更多还原