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MCM基极电测试技术
Electrical Test Technology of MCM’s Substraies
【摘要】 对于复杂的MCM多层互连基板,电测试是控制成本、确保质量的关键环节。本文简要介绍了探针电阻、电容、电子束、潜在开路缺陷电测试及其测试技术的应用。
【Abstract】 Fox complex MCM substrates, electrical test is afundamental element of cost control and quality assurance’ This paper presents electrical test of MCM substrates which include: probe resistance. capcitance.electron beam. latent open defects and applications ofthe test technologies.
【关键词】 电测试;
潜在开路缺陷;
薄膜测试;
多层基板;
电子束;
【Key words】 Electrical test; Latent open depects; Thin film.test; Multi-layer substrates; Electron beam;
【Key words】 Electrical test; Latent open depects; Thin film.test; Multi-layer substrates; Electron beam;
- 【文献出处】 微电子学与计算机 ,MICROELECTRONICS & COMPUTER , 编辑部邮箱 ,1998年03期
- 【分类号】TN405
- 【下载频次】30