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低毒室温固化环氧树脂复合体系的研究

STUDY ON AN EPOXIES COMPLEX SYSTEM WITH LOW TOXICITY FOR ROOM TEMPERATURE CURING

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【作者】 孙曼灵皮红郑水蓉

【Author】 Sun Manling; Pi Hong; Zheng Shuirong(Northwestern Polytechnical University, Xi’an, 710072)

【机构】 西北工业大学!西安710072

【摘要】 环氧树脂的室温固化体系通常多采用脂肪胺类作固化剂。如乙二胺等。但其毒性一般较大,强度和耐热性偏低。本文研究了一种低毒室温固化体系。由环氧树脂的新型固化剂DDDM(3,3'二乙基4,4'二氨基二苯甲烷)和低分子聚酰胺、三乙醇胺及活性稀释剂U-45组成。该体系的毒性大大低于乙二胺体系,而力学性能却高于乙二胺体系。由于采用了活性稀释剂U-45,不仅改善了该体系的工艺性能,同时其强度也有提高。该体系可用于室温固化的玻璃钢、胶粘剂、浇铸料等领域。

【Abstract】 The curing agent system for epoxy resins at room temperature was usually type of aliphatic amines such as ethylenediamine, which has disadvantages of poison, low strength and poor heat resistance. A new type of complex curing system with low toxicity for epoxy resins at room temperature was studied in this paper. It was made up of a new curing agent,3, 3’-diethyl-4, 4’-diaminodiphenylmethane (DDDM ), low-molecular polyamide, tri-ethanolamine and reactive diluent U-45’ Its toxicity is much lower than that of ethylenedi-amine, but the mechanical properties of the resin cured from it were better than that from ethylenediamine. Addition of reactive diluent U-45 improved not only processabilities of sys-tem but also the strength. It can be applied to areas of glassfiber reinforced plastics, adhe-sives, and resin casts, cured at room temperature.

【关键词】 固化剂复合物环氧活性稀释剂
【Key words】 Curing agentComplexEpoxy resinReactive diluent
  • 【文献出处】 热固性树脂 ,THERMOSETING RESIN , 编辑部邮箱 ,1998年03期
  • 【分类号】O633
  • 【被引频次】14
  • 【下载频次】295
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