节点文献
陶瓷表面化学镀铜动力学的研究
Study on Kinetics of Cu-plating Chemically on Ceramics Surface
【摘要】 从化学动力角度对陶瓷表面化学镀铜过程中的反应速率进行了初步探讨,由化学镀铜过程中的反应机理推导了动力学方程式,并根据试验结果计算了有关动力学参数,研究结果证明了陶瓷表面化学镀铜的可行性,所得的动力学方程式对生产实践有一定的指导意义。
【Abstract】 In this paper, the reaction rate of Cu - plating chemicalliy on ceramics surface was studied from the chemical kinetics aspect. Based on the reaction mechanism of chemical plating process, the kinetics equation was deduced and the related kinetics parameters were calculated by help of the experiment results. The study confirmed availability of Cu - plating chemically on ceramics surface. The attained equation is significant for production.
- 【文献出处】 菏泽师专学报 ,Journal of Heze Teachers College , 编辑部邮箱 ,1998年02期
- 【分类号】TQ174.1
- 【被引频次】3
- 【下载频次】159