节点文献
含铋铅锡焊料的组织与性能
Structure and Properties of Pb-Sn Solder Contain Bi
【摘要】 借助常规力学性能、物理性能、金相组织等检测技术.通过对合铋铅锡焊料的研究,结果表明:微量铋的加入能够提高合金的强度、硬度和低温搭接强度,同时降低合金的塑性,而对金相组织无明显影响。
【Abstract】 use of measurement technology of traditional mechanies properties.Physics properties.metallographic structure,after PbSn Solder Contain Bi is studied.Experimental results show that the strength of the alloy.hardness.strength of ocnnect is -improved after trace Bi element is mixxed,and the extendness is reduced,but there isn’t distinct influence in metallogrphic structure.
- 【文献出处】 湖南有色金属 ,HUNAN NONFERROUS METALS , 编辑部邮箱 ,1998年01期
- 【分类号】TG42
- 【被引频次】2
- 【下载频次】133