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高质量的光刻胶图型及它对Nb/AlO_x-Al/Nb隧道结制备的影响(英文)
HIGH QUALITY PHOTORESIST PATTERNING AND ITS INFLUENCE ON THE FABRICATION OF Nb/AlO x Al/Nb TUNNEL JUNCTIONS
【摘要】 本文用选择铌膜刻蚀或选择铌膜阳极氧化过程研究了全铌隧道结Nb/AlOxAl/Nb的制备.借助于SEM,利用曝光后烘烤处理研究了高质量光刻胶图形的制备工艺,并分析了其对铌结特性的影响.结面积为7μm2的铌结具有典型的IV曲线,在4.2K时,他们的特性参数Vm~20mV,能隙电压Vg~2.7mV,临界电流密度Jc~3000A/cm2,比电阻ρn~1μΩcm2.这些铌结能够被直接应用于dcSQUID.
【Abstract】 Abstract The fabrication of Nb/AlO x Al/Nb tunnel junctions is investigated using selective niobium etching process and selective niobium anodization process. High quality photolithographic patterning making use of post exposure bake is studied by means of SEM, and its influence on the junction characteristics is analyzed. Junctions with an area of 7μm 2 show typical I V characteristics, and at 4.2K, their quality parameters are: V m ~20mV, gap voltage V g ~2.7mV, critical current density J c ~3000A/cm 2, and specific resistance ρ n ~1μΩcm 2. These junctions can be applied to dc SQUID directly.
- 【文献出处】 低温物理学报 ,CHINESE JOURNAL OF LOW TEMPERATURE PHYSICS , 编辑部邮箱 ,1998年06期
- 【分类号】O511.1,TM263
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