【摘要】 研究了不同Ｃｕ２＋浓度、ｐＨ值及温度条件下的化学镀Ｎｉ－Ｃｕ－Ｐ工艺。结果表明，提高化学镀液温度或在较高的Ｃｕ２＋浓度下，可加快化学镀速度，提高镀层中Ｃｕ含量。镀层在较高Ｃｕ量下存在的少量化合物Ｎｉ５Ｐ２能使沉积颗粒细化。含Ｃｕ镀层具有较高硬度。更多还原

【Abstract】 Abstract The electroless NiCuP plating technology was studied under different Cu concentration,pH value and temperature. It showed that the electroless deposition rate and Cu content in deposit could be increased with更多还原