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酸性镀锡体系电化学振荡行为的研究
Electrochcmical Oscillating Behaviour of Acid Tin Plating System
【摘要】 研究了Sn(Ⅱ)-H2SO4溶液中,Sn(Ⅱ)还原过程在控电流条件下的电势振荡规律,考察了甲醛、聚乙二醇、β-萘酚等添加剂对振荡的影响,对该体系的振荡机理进行了探讨,认为这是一种目前未见报道的电化学振荡类型.
【Abstract】 The cathodic potential oscillating behaviour of Sn(Ⅱ ) in Sn (Ⅱ)-H2SO4 solution was studied , The effect of formaldehyde solution, polycthylene glycol and β- Naphthol on the oscillation was observed. The possible mechanism of the oscillation was discussed.
- 【文献出处】 材料保护 ,MATERIAIS PROTECTION , 编辑部邮箱 ,1998年10期
- 【分类号】O646
- 【被引频次】2
- 【下载频次】77