节点文献
高纵横比微孔列阵的干刻工艺
Dry etching Technology for High Aspect of Micro holes Array
【摘要】 本文简述了干法刻蚀的现状和Multiplex - ICP 的结构原理, 给出了高纵横比微孔列阵的初刻实验结果, 并对有关参数进行了初步讨论
【Abstract】 The present status of dry etching the structure and principle of Multiplex ICP were introduced in this paper.The primary experiment results on high aspect radip of the micro hole array were obtained.Finally,we discussed the geometric and processing parameters of the deep hole microchannel array prepared by ICP.
- 【文献出处】 长春光学精密机械学院学报 ,JOURNAL OF CHANGCHUN INSTITUTE OF OPTICS AND FINE MECHANICS , 编辑部邮箱 ,1998年04期
- 【分类号】TH706
- 【被引频次】4
- 【下载频次】81