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可焊性光亮锡铋合金电镀工艺研究
Study on the electroplating technology of solderable bright Sn-Bi alloy
【摘要】 研究了一种可焊性光亮锡铋合金电镀工艺的镀液配方和电镀操作条件;测试了镀液的分散能力、深镀能力、阴极电流效率和沉积速度;经小槽电镀,获得外观致密均匀、似镜面光亮、结合力强、具有优良的可焊性镀层.
【Abstract】 The bath components and the operating conditions for a new electroplating technology of solderable bright Sn-Bi alloy were studied. The covering power and throwing power as well as cathodic current efficiency and depositing velocity of the bath were determined. A uniform ,compact ,bright and excellent solderable coating with good adhesion was obtained by the experimental electroplating.
- 【文献出处】 表面技术 ,Surface Technology , 编辑部邮箱 ,1998年02期
- 【分类号】TQ153
- 【被引频次】10
- 【下载频次】161