【摘要】 研究了一种制备超细Ni/Cu包覆型复合粉的新工艺。以硫酸铜和硫酸镍为原料、酒石酸铵为络合剂、NaOH调节pH值、水合肼还原的化学共沉积法,制备了平均粒径为50nm的纳米级镍包铜(Ni/Cu)复合粉末。并从电化学、结晶学的角度阐述了制备粒度微细、包覆均匀的Ni/Cu复合粉末的基本原理。该方法利用液-液均相置换反应,采用温和的反应条件,直接制备纳米级复合粉末材料,具有方法简单、粉末粒度均匀、产品纯度高等优点。更多还原

【Abstract】 A novel technology for preparing nanometer Ni/Cu composite powder has been studied. The aqueous mixture of copper sulfate and nickel sulfate was reduced by hydrazine directly, with ammonium tartrate being complexing agent, NaOH being pH adjuster. Nanometer Ni-coated Cu composite powder with an average size of 50 nm was obtained, under the conditions of ρ(Cu²⁺+Ni²⁺=80g·L^-1, ρ（NH₄）₂C₄H₄O₆=50g·L^-1, ρ_NaOH=50g·L^-1, φ_N2H4·H2O=60％ and temperature 85℃. Also the principle for preparing ultrafine and well-distributed Ni/Cu composite powder was explained in detail by use of electrochemistry and crystallography. The process has simplicity,and the powder has well-distributed size and high purity.更多还原