【摘要】 分析置换镀铜的电化学沉积机理，研制出提高铜层结合强度的专用添加剂和防锈钝化剂，能有效地增加镀层致密度和抗锈蚀性能。更多还原

【Abstract】 To present the electrochemical deposition mechanism of copper plating by displacement Specialized additives and rust proofing passivators to improve the bonding strength of copper coating onto steel wire are developed The products above can increase the compactness and antirust property of the copper coating effectively更多还原