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离子束增强沉积TiN薄膜界面结合强度的研究

The Interfacial Bonding Strength of TiN Films Prepared by IBED

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【作者】 顾剑锋周平南杨晓豫

【Author】 Cai Xun, Gu jianfeng, Zhou Pingnan, Yang Xiaoyu(shanghai Jiaotong University)

【机构】 上海交通大学

【摘要】 采用划痕法测定了离子束增强沉积TiN薄膜的界面结合力。结果表明,由于在离子束增强沉积过程中TiN薄膜和基体之间生成一层厚约30~40nm的过渡层,从而大大改善了涂层的界面结合强度,其临界载荷可达140N,为一般PVD和CVD方法所生成的TiN膜的3~4倍,并且发现它并不随膜厚的增加而变化。

【Abstract】 In this work,the scratch test has been used to measure the adhesion of TiN films prepared by ion beam enhanced deposition.It is found that the interfacial bonding strength of TiN films can be significantly improved by IBED because there is transition layer with about 30 to 40nm between coating and substrate during the films deposition process.The critical load obtained on TiN film by the scratch test has been risen up to 140N,that is 3 to 4 times of that of TiN films formed by general PVD and CVD,and it doesn’t increase with the coating thickness.

【基金】 国家863高技术研究发展计划资助
  • 【文献出处】 金属热处理学报 ,TRANSACTIONS OF METAL HEAT TREATMENT , 编辑部邮箱 ,1997年02期
  • 【分类号】O484.1
  • 【被引频次】23
  • 【下载频次】213
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