【摘要】 采用多晶硅薄膜材料作为热敏电阻材料，以普通的ＩＣ工艺及微机械加工技术研制成功了在室温下工作的红外微测辐射热计，其多晶硅电阻温度系数为－２％℃－１，探测率Ｄ＊达２×１０８ｃｍ·Ｈｚ１／２·Ｗ－１．更多还原

【Abstract】 By using conventional Si LSI process and micromachining technology, a microbridge structure for the thermal isolation was made and a microbolometer was formed. Poly Si film material was used as the thermally sensitive resister because of its wide use in current IC technology. The detectivity (D *) of some 2×10 8cm·Hz 1/2 ·W -1 was observed.更多还原