节点文献
单片机在超声测厚仪中的应用
Application of Single Chip Processor inUltrasonic Thickness Measurement
【摘要】 运用8031单片机完成了智能化超声测厚仪各单元电路多数的协调控制,实现了在不同探头下测厚方法的自动选择和输出的自动调整,并通过自调程序对系统进行非线性补偿
【Abstract】 Harmonious Control among individual circuit parameters is realized in intelli- gent ultrasonic thickness measurement using a 8031 single chip processor Automatic selection of measuring methodsd for thickness using different detectors and automatic out -put control are realized A nonlinearity compensation is implemented in the system through a self-regulation program.
【关键词】 单片机;
超声测厚;
智能化;
【Key words】 single chip processor; ultrasonic thickness measurement; intellignet measure- ment process;
【Key words】 single chip processor; ultrasonic thickness measurement; intellignet measure- ment process;
- 【文献出处】 北京理工大学学报 ,JOURNAL OF BEIJING INSTITUTE OF TECHNOLOGY , 编辑部邮箱 ,1997年03期
- 【分类号】TP368.1
- 【被引频次】8
- 【下载频次】269