【摘要】 比较了使用金刚石膜热沉和传统的钢热沉的半导体激光二极管列阵在热阻和光输出功率方面的特性．与使用Cu热沉的器件相比，采用厚度为350～400μm，热导率在12～14W／（K·cm）的金刚石膜作为热沉的H极管列阵可使热阻降低45～50％，同值电流明显降低，而光输出功率提高25％，稳定性得到改善．表现出金刚石膜热沉在半导体器件散热方面的明显优势．更多还原

【Abstract】 Diamond film is used as heat sink in semiconductor laser, the characteristics of thermal resistance and power output for this laser are studied. A heat sink of diamond film with thermal conductivity of 6W/(K. cm) and thickness of 150μm has a good effect in decreasing thermal resistance of laser. A heat sink of diamond film with thermal conductivity of 12~14W/(K. cm) and thickness of 350~400μm decreases thermal resistance of about 45~50%, and increases the power output of about 25 %. The stability of laser is improved by using diamond heat sink.更多还原