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借助硅片减薄重掺硅间隙氧含量低温(10K)红外测量

Low Temperature 10K Infrared Measurement of Interstitial Oxygen in Heavily-Doped Silicon Via Wafer Thinning

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【作者】 王启元王俊韩秀峰邓惠芳王建华昝育德蔡田海郁元桓林兰英

【Author】 Wang Qiyuan; Wang Jun; Han Xiufeng; Deng Hui fang; Wang Jianhua;Zan Yude; Cai Tianhai; Yu Yuanhuan and Lin Lanying(Institute of Semiconductors,The Chinese Academy of Sciences, Beijing 100083)

【机构】 中国科学院半导体研究所!北京100083中国科学院

【摘要】 本文首次报道了一种新颖的重掺硅中间隙氧含量测量技术,通过硅片减薄并采用低温红外透射测量,明显降低了重掺硅自由载流子吸收的严重干扰,提高了红外吸收峰信噪比,在1136cm-1附近得到了明显的Si-O键红外吸收峰,从而可以准确地测量重掺硅间隙氧含量.实验结果表明:该测量方法具有很高的测量准确度和更宽泛的电阻率应用范围.对于重掺n型硅,其测量应用范围可扩展至电阻率1×10-2Ω·cm(自由载流子浓度高达4×1018cm-3).

【Abstract】 A new technique is reported for rapid determination of interstitial oxygen(Oi) inheavily Sb-doped CZ silicon. This technique includes the application of wafer thinning andlow temperature (10K) FTIR transmittance to measure Si-O infrared absorption bandaround 1136cm-1. Mechanical wafer thinning combined with 10w temperature FTIR canmarkedly reduce the frequency-independent absorption by excess free carriers and increase the intensity of transmitted light. As a result, a high signal-to-noise ratio for Oi infrared absorption band is attained. Our results show that this method has a high reliabilityof measurement and can.be used at resistivity down to 0. 01Ω· cm for n-type heavily Sbdoped (up to 4×1018cm-3) silicon.

  • 【文献出处】 半导体学报 ,CHINESE JOURNAL OF SEMICONDUCTORS , 编辑部邮箱 ,1997年08期
  • 【分类号】TN21
  • 【被引频次】4
  • 【下载频次】79
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