STUDY OF THERMAL DEFORMATION OF MICROELECTRONICS PACKAGING PRODUCT BY INTERFEROMETRIC TECHNIQUE

【摘要】 <正> In this paper,the out-of-plane deformation of silicon surface ofDirect Chip Attachment(DCA)assembly,under thermal loading,was measured inreal-time by Twyman/Green interferometry.The contour maps of the out-of-planedisplacement fields of silicon surface under thermal loading and cycling of varioustemperature were obtained.Experimental results show that the relation betweenthe out-of-plane displacement and temperature is nonlinear and varies with tempera-ture cycling,due to nonlinear mechanical behavior of the materials used in electronicpackaging.A comparison of the out-of-plane displacement fields of silicon surfacemeasured by T/G interferometry in real-time and replicating technique of high tem-perature specimen grating of moire interferometry was made.更多还原

【Abstract】 In this paper,the out-of-plane deformation of silicon surface of Direct Chip Attachment(DCA)assembly,under thermal loading,was measured in real-time by Twyman/Green interferometry.The contour maps of the out-of-plane displacement fields of silicon surface under thermal loading and cycling of various temperature were obtained.Experimental results show that the relation between the out-of-plane displacement and temperature is nonlinear and varies with tempera- ture cycling,due to nonlinear mechanical behavior of the materials used in electronic packaging.A comparison of the out-of-plane displacement fields of silicon surface measured by T/G interferometry in real-time and replicating technique of high tem- perature specimen grating of moire interferometry was made.更多还原