【摘要】 磁控溅射镀膜技术由于其显著的特点已经得到广泛的应用。但是常规磁控溅射靶表面横向磁场紧紧地束缚带电粒子，使得在镀膜区域的离子密度很低，一定程度上削弱了等离子体镀膜的优势。通过有意识地增强或削弱其中一个磁极的磁通量，使得磁控溅射靶的磁场不平衡，可以大大提高镀膜区域的等离子体密度，从而改善镀膜质量。此外还讨论该项技术目前的发展状况。更多还原

【Abstract】 Magnetron sputtering has beconle a widely used physical vapor deposition technique due to itsoutstanding features. While the parallel magnetic fleId on a standard magnetron target strongly restricts thee1ectrons and in turn ions nearby frorn escaPing towards substrates,resulting in a quite low plasma density incoating area,which makes the benefit of using the magnetron sputtering technique Iost to some extent. Bystrengthening or weakening the magnetic flux from one fo the two opposite magnetic poles in order to establish an unbalanced magnetic field,one couId greatly enhance the plasma density in the coating area and irnprove the properties of deposlted films. This paper presents the deve1opment and the prosperity of this technique.更多还原