【摘要】 金属迁移能导致混合微电路发生灾难性失效。本文介绍一种简单易行的测试方法──水滴试验法，来测量厚膜电路的实际金属迁移率。用此方法测量时，发现Ｐｄ－Ａｇ导体的迁移率最大，Ｐｔ－Ａｕ导体的金属迁移率最小。并且应用电化学理论分析了Ｐｄ－Ａｇ导体的金属迁移过程．最后根据实验及分析，提出了抑制厚膜导体金属迁移的若干措施。更多还原

【Abstract】 Metal Migration has been the cause of many catastrophic microcircuit failures. in this paper we discribed an effective and simple test-water drop test.It’s a good practice to test thick film conductor for metal migrations.Tie results was given here: Pd-Ag conductors had the highest propensity of migration,Pt-Au conductors had the lowest one. Also, metal migration in Pd-Ag conductors has been studied with electrochemical theory. Finally some ground rules to suppress of prevrnt migration have been suggested.更多还原