节点文献
等离子体提纯硅粉的实验研究
PLASMA ENHANCED PURIFICATION EXPERIMENT OF SILICON MATERIAL
【摘要】 本文阐述了等离子体工艺在硅粉提纯方面的应用,在真空条件下,利用HCl或含氯气体化合物,经射频辉光放电形成等离子体与硅粉中的杂质反应,可以在较低的温度下(200℃~400℃)、较短的时间(1~2小时)内,除去硅粉中的大部分杂质,而且操作简单,功耗较低。
【Abstract】 Low temperature plasma technology is applied in the purification of silicon material. Under the condition of r. f. glow discharge plasma, the active gases which include HCl enhances the process of purification reactions. With low experiment temperature (200℃-400℃) and short experiment time (1-2 hours),most of impurities in the silicon have been removed off.
【关键词】 等离子体;
硅材料;
气-固反应;
提纯;
【Key words】 plasma; silicon material; gas-solid reaction; purification Supported by National Natural Science Foundation of China;
【Key words】 plasma; silicon material; gas-solid reaction; purification Supported by National Natural Science Foundation of China;
【基金】 国家自然科学基金
- 【文献出处】 微细加工技术 ,MICROFABRICATION TECHNOLOGY , 编辑部邮箱 ,1996年01期
- 【分类号】TN304.12
- 【被引频次】3
- 【下载频次】156