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掺砷多晶硅的热氧化
Thermal Oxidation of Arsenic-Doped Polysilicon in EEPROM Process
【摘要】 在EEPROM的研制中,为了研究掺砷多晶硅与单晶硅氧化的相对关系,进行了800℃湿氧氧化和1000℃干氧氧化实验。结果表明,经过工艺优化,选择适当的工艺方案,获得了较理想的多晶硅与单晶硅氧化速率比。
【Abstract】 To study the dependence of oxidation rate for arsenic-doped polysilicon and single crystalline silicon on the implantation dosage, an 800℃ wet oxidation and a 1000℃ dry oxidation were performed. Results from the experiments show that satisfactory ratio of polysilicon to Si oxidation rate can be achieved by using proper process scheme.
【关键词】 存储器电路;
EEPROM;
半导体工艺;
多晶硅;
热氧化;
【Key words】 Memory IC; EEPROM; Semiconductor process; Polysilicon; Thermal oxidation;
【Key words】 Memory IC; EEPROM; Semiconductor process; Polysilicon; Thermal oxidation;
- 【文献出处】 微电子学 ,MICROELECTRONICS , 编辑部邮箱 ,1996年03期
- 【分类号】TN305.3
- 【被引频次】1
- 【下载频次】168