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ABS表面化学镀Cu/Ni-P的电磁屏蔽功能

Electromagnetic Shielding Effect of Electroless Copper/Nickel--Phosphorus on ABS Surface

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【作者】 张丽芳刘金玲李文明任宝林石殿普

【Author】 Zhang Li fang, Liu Jiming, Li Wenming, Ren Baolin, Shi Dianpu(Department of Packaging Engineering, Jinn University, Clangchun, 130023)

【机构】 吉林大学包装工程系

【摘要】 在ABS塑料表面以化学镀沉积CU/Ni-P双镀层,并探讨其与基体的结合强度、环境稳定性、导电性及电磁屏蔽性能;以SEM观察了镀层的微结构及表观形貌.研究结果表明,ABS/Cu/Ni-P材料具有较高的电磁屏蔽效率,且经久耐用.

【Abstract】 The present paper deals with deposition of the bilayer on ABS surface by means of electroless and the attaching intensity with the substrate (ABS), environmental stability, conductivity, and electromagnetic shielding effect of electroless Cu/Ni--P bilayer on ABS surface in detail. The microstructure and the apparent morphology of the bilayer on ABS plastic surface were obserred bymeans of SEM. The results showed that ABS/Cu/Ni--P bilayer possesses a high electromagnetic shielding effect and is durable.

  • 【文献出处】 吉林大学自然科学学报 ,ACTA SCIENTIARIUM NATURALIUM UNIVERSITATIS JILINENSIS , 编辑部邮箱 ,1996年03期
  • 【分类号】TQ325.2
  • 【被引频次】8
  • 【下载频次】169
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