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PAN/Cu/Ni纤维及复合材料的电磁屏蔽性能

PAN/Cu/Ni Fibers and Electromagnetic Shielding Performance of Its Composite Material

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【作者】 张丽芳; 刘金玲; 李文明; 刘适; 石殿普;

【Author】 Zhang Lifang, Liu Jiming, Li Wenming, Liu Shi, Shi Dianpu (Department of Packaging Engineering, Jinn University . Chanchun, 130023)

【机构】 吉林大学包装工程系;

【摘要】 用聚丙烯腈纤维经化学镀铜再电镀镍制成的导电PAN/Cu/Ni纤维作填料,与HIPS树脂熔融共混,制备了导电复合材料.对纤维表面镀层的形态结构、导电性及复合材料的导电性和电磁屏蔽性(包括导电填料量、混炼时间及纤维表面处理等)进行了深入地研究.同时对复合材料电磁屏蔽的理论值与实验值做了比较.

【Abstract】 The conductive composites were preparaed by melting PAN/Cu/Ni fibers, obtained by means of electroless copper and then electroplating nickel, with HIPS resin blends. We have made a detailed study of fiber surface layer’s state, structure, conductivity and electromagnetic shielding property and conductivity of the composites. The volumes of filler, blending time and surface treatment of fiber etc. were also studied. Experimental values of the electromagnetic shielding of composites were compared with calculated values.

  • 【文献出处】 吉林大学自然科学学报 ,ACTA SCIENTIARIUM NATURALIUM UNIVERSITATIS JILINENSIS , 编辑部邮箱 ,1996年01期
  • 【分类号】TM243
  • 【被引频次】13
  • 【下载频次】130
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