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铝基化学镀镍的研究

Study on Electroless Nickel Plating on Aluminium

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【作者】 迟兰洲胡文成

【Author】 Chi Lanzhou;Hu Wencheng(Dept. of Appl Chem.,UEST of China Chengdu 610054)

【机构】 电子科技大学应用化学系

【摘要】 研究了铝基化学镀镍的工艺过程,详细介绍了化学镀镍前的处理过程,其中包括除油,浸蚀,清洗和没锌过程。研究了各因素对化学镀镍镀速的影响因素,并得出最佳配方及工艺条件。在最佳条件下,化学镀镍镀速高,镀层着附力优异,可焊性优良。

【Abstract】 This paper studies a technology process of electroless nickel plating on aluminium.The pretreatment consists of cleaning, etching, rinsing, zincate. The relation between the plating rate and primary factors in electroless nickel plating is developed.It is found that increasing the concentrations of nickel sulfate and sodium hypophosphite,temperature and pH improves the plating rate.There is a maximum of plating rate with the complexing agent increasing. The plating rate,stability of bath,hardners and solderability of deposition are satisfactory when the technology is operated with optimum conditions which are:nickel sulfate 30 g/L,sodium hypophosphite 30 g/L,complexing agent 19g/L,temperature 90℃,pH 5, stabilizer 3 ppm.

【关键词】 化学镀镍预处理镀速
【Key words】 electroless nickel platingaluminiumpre-treatmentplating rate
  • 【文献出处】 电子科技大学学报 ,JOURNAL OF UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINA , 编辑部邮箱 ,1996年01期
  • 【分类号】TQ153.12
  • 【下载频次】161
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