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VLSI和PCB双层布线中的通孔最少化算法

Via Minimization Algorithm for Double-Layer in VLSI and PCB

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【作者】 洪先龙潘立王尔乾

【Author】 Hong Xianlong;Pan Li and Wang Erqian(Department of Computer Science and Technology,Tsinghua University,Beijing 100084)

【机构】 清华大学计算机科学与技术系

【摘要】 本文提出了一个新的通孔最少化层分配的图模型.该模型克服了传统层分配算法对通孔度数和位置的限制,允许通孔自由地以任意度数和任何需要的位置出现.模型中还提出了通孔秩的概念,它比较能更精确地反映通孔的本质.在此基础上,本文将通孔最少化问题转化为图的最大割问题,并提出了一种启发式算法去求解图的最大割.算法已用C语言在SUN工作站上实现.实验结果表明,算法十分有效且稳定.

【Abstract】 Abstract A new graphic model of layer assignment for via minimization is proposed.The model has overcome strict limitations of traditional layer assignment methods in via degree and location, and allows that the via appears with freedom in any degrees and anywhere.The conception of via rank is proposed in this model.It can represent the essence of via more precisely than degree of via.Then the via minimization problem is formulated as a maximum cut of weighted graph and a heuristic algorithm is used to solve it. The algorithm is implemented in C language under UNIX operating system on SUN workstation.Experiment results show that the algorithm is efficient and stable.

【关键词】 通孔PCB布线问题求解图侯选印刷电路板走线网段子图暂态
【基金】 国家自然科学基金
  • 【文献出处】 半导体学报 ,CHINESE JOURNAL OF SEMICONDUCTORS , 编辑部邮箱 ,1996年07期
  • 【分类号】TN405.97
  • 【被引频次】6
  • 【下载频次】74
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