节点文献
铜合金化学镀Ni-P表面强化的探讨
Study on Surface Strengthening of Copper Alloy by Ni-P Chemical Deposition
【摘要】 研究了铜合金化学镀Ni—P合金的工艺条件;时效温度、时效时间对镀层晶态转变、硬度与基体结合力的影响,比较了化学镀前后的耐磨性、耐蚀性。结果表明,化学镀Ni-P合金后,铜合金的表面硬度、耐磨性、耐蚀性都显著提高。
【Abstract】 The technique of Ni-P alloy chemical deposition on copper alloy surface is studied,and the influences of technical conditions,aging temperature and aging time of the technique on the crystallization and hardness of coated layer and the bond between matrix and coated layer are investigated. The results show that the surface hardness, wear resistance and corrosion resistance of the copper are obviously improved by Ni - P alloy chemical deposition.
【关键词】 化学镀;
Ni-P合金;
表面强化;
铜合金;
【Key words】 chemical deposition; Ni-P alloy; surface strengthening; copper alloy;
【Key words】 chemical deposition; Ni-P alloy; surface strengthening; copper alloy;
- 【文献出处】 金属热处理 ,Heat Treatment of Metals , 编辑部邮箱 ,1995年12期
- 【分类号】TQ15
- 【被引频次】10
- 【下载频次】145