节点文献
电子封装铝基复合材料热循环曲线研究
INVESTIGATION OF THERMAL CIRCLING CURVE OFAL UMINUM-MATRIX COMPOSITES FORELECTRONIC PACKAGING
【摘要】 研究了热循环对铝基复合材料热膨胀和冷却收缩曲线的影响。发现电子封装纤维增强铝基复合材料的热循环曲线是不封闭的。热循环曲线的形状、不封闭程度同增强体的种类、测试方向、热循环温度区间以及热循环次数等因素有关。利用细观力学理论较好地解释了这些现象。
【Abstract】 The effects of thermal circling on the curve of heat expansion and cold contraction are investigated. Itis found that the thermal circling curves of aluminum-matrix composites reinforced with carbon fiber forelectronic packaging are not close. The curve shape and close extent of thermal circling are related to rein-forcernents ,sarnple orientation ,thermal circling number of times and temperature range. These phenomenaare explained by micro-mechanics.
【关键词】 铝基复合材料;
温度循环试验;
热膨胀;
电子封装;
【Key words】 aluminum-matrix composites; thermal circling tests; thermal expansion; elec-tronic packaging;
【Key words】 aluminum-matrix composites; thermal circling tests; thermal expansion; elec-tronic packaging;
- 【文献出处】 航空材料学报 ,JOURNAL OF AERONAUTICAL MATERIALS , 编辑部邮箱 ,1995年01期
- 【分类号】TN305.94
- 【被引频次】16
- 【下载频次】172