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掺砷多晶硅特性研究

Study on the Characteristics of As Doped Poly-Si

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【作者】 陈统华张树丹

【Author】 Chen Tonghua;Zhang Shudan(Nanjing Electronic Devices Institute, 210016)

【机构】 南京电子器件研究所

【摘要】 用LPCVD方法生长了掺As多晶Si薄膜,通过能谱分析,扩展电阻测量,扫描电子显微镜观测,发现用LPCVD方法生长的掺As多晶Si可获得极高的掺As浓度,As对衬底材料(SiO2或多晶Si)具有超常的低温快扩散特性,掺As多晶Si经高温退火,晶粒大小有反常的变化。利用这些特性可成功地解决LPCVD法生长掺As多晶Si所遇到的生长速度愈来愈慢,As浓度愈来愈高,难以生长较厚掺As多晶Si等问题。

【Abstract】 As doped poly-Si is grown by LPCVD method. By using AES andTEM,it is found that.As doped poly-Si has an extremely high concentration of As.As can rapidly diffuse into substrate (poly-Si or SiO2)at lower temperature. Afterhigh temperature annealing,active As concentration increases. But diameter of crystalline grain reduces. By using these properties of As doped poly-Si,it is possible toachieve high deposition rate of As doped poly-Si and good control of As concentration.

  • 【文献出处】 固体电子学研究与进展 ,RESEARCH & PROGRESS OF SOLIA STATE ELECTRONICS , 编辑部邮箱 ,1995年01期
  • 【分类号】O472
  • 【下载频次】71
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