【摘要】 本文介绍了电子封装的各种类型，综述了电子封装技术与封装材料的现状及发展趋势，重点讨论了高热导ＡＩＮ基片金属化及ＡＩＮ－Ｗ多层共烧工艺。更多还原

【Abstract】 The types of electronic packaging are introduced and the current state and tendency of packaging technologies an materials are reviewed in this paper.The emphasis,is placed on the metallization of high thermal conductivity AIN ceramics substrates and AIN-W co-fired multilayer substrates.更多还原