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填充环氧树脂界面残余应力研究——Ⅳ.界面残余应力形成的分子机理

STUDIES ON INTERFACIAL RESIDUAL STRESS IN FILLED EPOXY RESIN. IV MECHANISM OF BUILD UP OF INTERFACIAL RESIDUAL STRESS

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【作者】 王洪冰李善君于同隐

【Author】 Wang Hong-bing. Li shan-jun. Yu tong-yin(Fudan University. Shanghai)

【机构】 复旦大学复旦大学

【摘要】 本文针对橡胶改性环氧树脂体系,从微观分子运动角度对界面残余应力形成原因进行了初步探索,发现复合材料界面残余应力的生成是界面处分子运动不平衡所导致的。同时界面残余应力有效体积是一个重要参数,它和材料温度以及界面键合强弱有关。

【Abstract】 The factors inducing the build-up of interfacial residual stress in rubber-filled epoxy resin system were preliminarily investigated on the basis of micromolecular motion. It was found that the build-up of the interfacial residual stress in the composite was induced by the nonequilibrium of molecular motion at the interfaces. The effective volume of the residual stress was an important parameter, which was relative to the temperature of the composite and the linking strength at the interfaces.

  • 【文献出处】 热固性树脂 ,Thermosetting Resin , 编辑部邮箱 ,1994年03期
  • 【分类号】TQ323
  • 【被引频次】2
  • 【下载频次】144
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