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填充环氧树脂界面残余应力研究——Ⅲ.界面残余应力的热行为

STUDY ON INTERFACIAL RESIDUAL STRESS IN FILLED EPOXY RESIN. III. THERMAL BEHAVIOR OF INTERFACIAL RESIDUAL STRESS

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【作者】 王洪冰李善君于同隐

【Author】 Wang Hong-bing, LiShan-jun, Yu Tong-yin(Fudan University, Shanghai))

【机构】 复旦大学复旦大学

【摘要】 本文针对橡胶填充环氧树脂体系和玻璃珠填充环氧树脂体系,研究了界面残余应力的退火效应和温度变化行为。样品的残余应力与退火时间有关。温度与界面残余应力成线性反比关系。在两体系中,界面残余应力随温度升高而下降的速度不相同。

【Abstract】 The study was made on the effect of annealing and annealing temperature on the interfa-cial residual stress in rubber-filled and glass bead-filled epoxy resin systems.The residual stress in the specimens was related to the annealing time,and the there was a linear proportion by inversion between the annealing temperature and the interfacial residual stress. The rate of fall-off of the interfacial residual stress with the rise of the annealing temperature is different in the two systems.

  • 【文献出处】 热固性树脂 ,Thermosetting Resin , 编辑部邮箱 ,1994年01期
  • 【分类号】TQ323
  • 【被引频次】3
  • 【下载频次】156
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