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填充环氧树脂界面残余应力研究——Ⅲ.界面残余应力的热行为
STUDY ON INTERFACIAL RESIDUAL STRESS IN FILLED EPOXY RESIN. III. THERMAL BEHAVIOR OF INTERFACIAL RESIDUAL STRESS
【摘要】 本文针对橡胶填充环氧树脂体系和玻璃珠填充环氧树脂体系,研究了界面残余应力的退火效应和温度变化行为。样品的残余应力与退火时间有关。温度与界面残余应力成线性反比关系。在两体系中,界面残余应力随温度升高而下降的速度不相同。
【Abstract】 The study was made on the effect of annealing and annealing temperature on the interfa-cial residual stress in rubber-filled and glass bead-filled epoxy resin systems.The residual stress in the specimens was related to the annealing time,and the there was a linear proportion by inversion between the annealing temperature and the interfacial residual stress. The rate of fall-off of the interfacial residual stress with the rise of the annealing temperature is different in the two systems.
- 【文献出处】 热固性树脂 ,Thermosetting Resin , 编辑部邮箱 ,1994年01期
- 【分类号】TQ323
- 【被引频次】3
- 【下载频次】156