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用时间分辨反射率技术研究硅的固相外延
The study of solid phase epitaxy in silicon by the time-resolved reflectivity technique
【摘要】 用时间分辨反射率技术实时测量了Si+、As+注入单晶硅的固相外延生长速率和外延层厚度,并与背散射沟道方法测得的非晶层厚度进行了比较。介绍了测量原理,分析了实验结果.
【Abstract】 he time-resolved reflectivity(TRR) technique has been used to measure the solid phase epitaxial growth rate and the thickness of epitaxial layer for Si+ and As+implanted single crystalline wafers.The thickness of amorphous layer for the As-implanted samples has been determined by backscattering-channeling analysis to confirm the measured TRR results.The principle of the TRR technique is introduced and the experimental result is discussed.
【关键词】 单晶硅;
离子注入;
固相外延;
反射率;
【Key words】 Crystal silicon; Ion implantation; Solid phase epitaxy; Reflectivity;
【Key words】 Crystal silicon; Ion implantation; Solid phase epitaxy; Reflectivity;
【基金】 国家自然科学基金
- 【文献出处】 核技术 ,NUCLEAR TECHNIQUES , 编辑部邮箱 ,1994年08期
- 【分类号】TN304.054
- 【下载频次】32