【摘要】 试验研究了三种半导体致冷电对金属化系统的拉伸强度，其中铋─镍─锡金属化系统与半导体致冷材料粘接强度最高，超过原始棒状材料的拉伸强度，它是半导体致冷器电对的最好的金属化系统．更多还原

【Abstract】 The adhesive strength of three thermeolectric cooling couple metallization systems have ho tested. The adhesive strength of Bi-Ni-Sn metallization system is the highest,and exed the tensil strength of the rod form thermoelectric cooling material ingot,for this reason, the Bi-Ni-Sn metallization system is the best for the thermoelectric cooling couple metallization.更多还原