【摘要】 本文利用俄歇电子谱（ＡＥＳ）及透射电镜（ＴＥＭ）对比分析了国产、日本、和西德热浸镀Ａｌ－２％Ｓｉ钢带界面化合物层的厚度、结构和组成。结果表明，Ｓｉ以Ｆｅ＿２（ＡｌＳｉ）＿５的形式存在于Ｆｅ＿２Ａｌ＿５结构的界面化合物中。与热浸镀Ａｌ相比，添加Ｓｉ后导致界面化合物层厚度下降的原因在于Ｓｉ填充了Ｆｅ＿２Ａｌ＿５结构中原子空位、阻碍了Ａｌ原子的扩散。更多还原

【Abstract】 he thickness、structure and composition of the interfacial compound layer of steel strip of hot dippingAl-2%Si. which were from the native、Japan and West Germany, have been compared and investigatedby AES and TEM.The results show silicon would be rich preferentially in the interfacial compound layerwhose structure was the same as Fe₂Al₅ phase. and could be written as Fe₂ （AlSi ）₅.The reason for reducingthe interfacial compound layer thickness during hot dip aluminizing after adding 2%silicon were that va-cant atom sites in the Fe₂ Al₅ were filled by Silicon and the diffusion of alunnnium through Which were in-hibited Other reason has also been found besides the function of silicon such as the forming of the interfa-cial aluminium oxide.更多还原